专利名称：Surface mounting of components发明人：Chengalva, Mahesh K.,Chengalva, Suresh
K.,Snyder, Rick B.
申请号：EP05075085.0申请日：20050111公开号：EP1558065A3公开日：20071114
专利附图：
摘要：Surface mounting of components includes providing a substrate (10) that has afirst surface and a second surface. A portion of the first surface is coupled to a conductivelayer (20) that is patterned. A compliant layer (50) is introduced to the first surface of the
substrate (10) and to the conductive layer (20). At least one aperture is formed in thecompliant layer (50) which extends to the surface of the conductive layer (20). Conductivematerial is introduced into the aperture(s). Solder couples the surface mount component(90) to the compliant layer (50).
申请人：Delphi Technologies, Inc.
地址：PO Box 5052 Troy, MI 48007 US
国籍：US
代理机构：Denton, Michael John
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